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AD8011 ABSOLUTE MAXIMUM RATINGS 1

MAXIMUM POWER DISSIPATION

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V Internal Power Dissipation2 Plastic Package (N) . . . . . . . . . . . . Observe Derating Curves Small Outline Package (R) . . . . . . . Observe Derating Curves Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 2.5 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range (N, R) . . . . . . . . –65°C to +125°C Operating Temperature Range (A Grade) . . . – 40°C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C

The maximum power that can be safely dissipated by the AD8011 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150°C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175°C for an extended period can result in device failure. While the AD8011 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves (shown below in Figure 3).

NOTES 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for device in free air: 8-Pin Plastic Package: θJA = 90°C/Watt 8-Pin SOIC Package: θJA = 140°C/Watt

MAXIMUM POWER DISSIPATION – Watts

2.0

ORDERING GUIDE

Model

Temperature Range

Package Option

AD8011AN AD8011AR AD8011-EB

– 40°C to +85°C – 40°C to +85°C

8-Pin Plastic DIP 8-Pin SOIC Eval Board, SOIC, G = +2

TJ = +150°C 8-PIN MINI-DIP PACKAGE 1.5

1.0

8-PIN SOIC PACKAGE 0.5

0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE – °C

80 90

Figure 3. Maximum Power Dissipation vs. Temperature CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8011 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

–4–

WARNING! ESD SENSITIVE DEVICE

REV. 0


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